From March 11 to 13, Gianluca Cerio and Massimiliano Curti attended the Embedded World Exhibition & Conference 2025 in Nuremberg, one of the most anticipated events in the embedded world. The event serves as a key meeting point for companies, experts, and researchers working on essential yet often unseen technologies, systems that operate in the background, embedded in the devices and infrastructures we rely on daily, ensuring their functionality and advancement.
Embedded World 2025: Key Topics in Focus
Each year, the Exhibition provides a snapshot of the state of the art in embedded technology. This year, the spotlight was on four main themes: artificial intelligence, connectivity, cybersecurity, and edge computing. These technologies are transforming the sector, making systems increasingly autonomous, interconnected, and secure.
The Conference featured keynotes, courses, and technical sessions discussing how these innovations are shaping device and infrastructure design. Topics included new hardware architectures, optimized operating systems, and the tightening of security standards in the coming years.
Gianluca Cerio and Massimiliano Curti closely followed the most relevant discussions, exchanging ideas with other specialists on how embedded systems are evolving in industries such as automotive, telecommunications, industrial automation, and medical technology.
Here are their insights from the event.
Gianluca Cerio
Which of the technologies presented at Embedded World do you think will have the greatest short-term impact? And why?
Keyword: Embedded AI. At the event, booths showcasing artificial intelligence applications integrated into low-cost boards were everywhere. The solutions ranged from playground monitoring systems capable of detecting children’s falls to the recognition of everyday objects. In the industrial sector, embedded AI continues to prove itself as an asset for process control, optimizing production, and improving quality. The result? Affordable end products, with prices ranging from a few dozen to a few hundred euros, depending on the technological setup, including 5G, WiFi, BLE, GPS, and other communication interfaces. One important highlight: the application of UWB (ultra-wideband) for indoor positioning, which was featured in multiple booths with diverse use cases.
Security in embedded systems was a hot topic. What are the main challenges companies will face in this area in the coming years?
A recurring theme is the Cyber Resilience Act (CRA), which will introduce new standards for connected devices starting in 2027. It will mandate certified hardware, security-by-design development, and continuous monitoring. Industry players are realizing how far their clients are from compliance, which will drive significant investments. Interestingly, the simplest connected devices often pose the greatest risks, making them vulnerable to attacks. Well-known cases illustrate this reality, such as hacking through surveillance cameras or the infamous 2017 casino breach, where attackers infiltrated the internal network via an aquarium temperature sensor.
Massimiliano Curti
Which emerging trends in the embedded sector could radically change the way devices are designed in the coming years?
The emerging trends I see are essentially three:
- The introduction of NPUs (Neural Processing Units), paired with the main processor to efficiently run Machine Learning algorithms.
- The integration of AI tools within software environments to accelerate and automate various operations.
- The implementation of cybersecurity modules to enhance the resilience of digital products, particularly in preparation for the Cyber Resilience Act (CRA).
After your discussions at Embedded World, what opportunities do you see for innovation at Teoresi in this field?
The opportunities lie in leveraging AI, during both the design phase and execution phase (at the edge on low-cost embedded devices). Equally important is cybersecurity, focusing on analysis, implementation, and testing leveraging the new features available in the latest generations of MCUs/MPUs.